Atmospheric Pressure (AP) Plasma Module for Wafer Level Packaging

 


PSM Co., Ltd. has led the development of atmospheric pressure plasma technology through constant technological innovation for the past 20 years since its establishment in 2001. That creates new high-value-added markets.

As a leader of the atmospheric plasma commercialization technology both in Korea and overseas, PSM currently possesses patents for core atmospheric plasma technologies and will continue to invest in technological innovation and quality improvement by strengthening the technology innovation group and the QC sector.

What patents PSM holds

 ü  HUMIDIFICATION APPARAUS HAVING PLASMA DISCHARGER WIH THREE DIMENSIONAL CELL STRUCTURE AND METHOD THEROF semiconductor packaging technology

ü  APPARATUS AND METHOD FOR PLASMA FORMATION OF MICRO ARC PREVENTION TYPE

ü  ATMOSPHERIC PRESSURE PLASMA PROCESSING APPARATUS AND ITS PROCESS

ü  PLASMA TREATMENT APPARATUS USING DUAL FREQUENCIES ANDPLASMA TREATMENT METHOD

ü  IN-LINE DIE CLEANING APPARATUS AND METHOD USING PLASMA

ü  INJECTION TYPE PLASMA TREATMENT APPARATUS

ü  PLASMA TREATMENT SYSTEM AND MLCC MANUFACTURING METHOD USING THE SAME

ü  PLASMA GUN FOR MEDICAL TREATMENT

ü  ROTATION DRUM TYPE PLASMA TREATING APPARATUS

ü  FOOD POWDER STERILIZATION EQUIPMENTS USING PLASMA

 

PSM Atmospheric Pressure (AP) Plasma Module for Wafer Level Packaging

 

M-AP Plasma Series are compact in-line Atmospheric Pressure (AP) plasma modules for very efficient surface cleaning and surface modification for Wafer, Glass, Plastics, and Polymer Substrate.

 Features of Wafer Level Packaging

 ü  No outgassing and no serious ESD issues in Wafer Level Packaging Process with high efficient     

wafer cleaning performance.

ü  Less failure rate than in the conventional vacuum plasma process for WLP processes.

ü  M-AP Plasma Modules can be effectively used for cleaning & etching organic and inorganic contaminants to improve the adhesion property of the over layer on Glass and Polymer Substrates. vacuum plasma technique

 General Specifications of Wafer Level Packaging

 ü  Treatment Effect: Contact Angle: < 5° at 100mm/s

ü  Process Gap: Max. 8 mm

ü  Process Gas: Mixed Gas (N2 + CDA), F-Gas

ü  Low Operation Voltage: 6kV ~ 8kV

ü  No Cooling Water (Air Cooling Only)

ü  Gas Interlock for Safe operation

ü  Exhaust: ~400 Pa

 

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