PSM Plasma Technology of NPT V31 Vacuum Plasma Cleaner for PCB Desmear & Teflon Activition

PSM Plasma Systems is global leader plasma technology for Semiconductor, PCB, LCD and Material industries.

We PSM Inc. has rich experience and excellent staffs who have developed and commercialized various highly evaluated optimized processing techniques and practical manufacturing systems which are related to Semiconductor & Display industry, PCB & FCCL industry and other polymer industries over 10 years in the Institute for Advanced Engineering.  

This is indeed useful technique that is able to improve productivity and quality simultaneously not only for semiconductor/displays/electronic parts, but for low-temperature material industry such as polymer & plastic / FPCB & FCCL by a possible in-line process.  

PCB Applications:

AP (Atmospheric Pressure) Plasma System

AP (Atmospheric Pressure) Plasma System Can treat substrate automatic in-line process.

PSM NPT series AP plasma system is applicable for whole back-end line of PCB/ SMT. This NPT series provides good uniformity and process consistency. Atmospheric Pressure Plasma Cleaning System

PCB (NPT306):

Fine Pitch is the latest trend in PCB Substrate.

Fine Pitch (Smaller Circuit Width, Circuit Gap and Ball Pad Size) have caused increased failure such as Pit Failure, Wetting Failure, Organic Residual Remove and Surface Cleaning.

These issues have led to increased requirement for plasma processing. More>>

SMT & PCB(NPT304-300s):

Pre-treatment of screen print, ball placement.

PCB & Wafer flip chip bumping.

(Decrease defect of small & large& missing problems) More>>

Vacuum Plasma System:

PCB Desmear (NPT-V31)

The NPT-V31 plasma system is widely used for the surface cleaning and modification process of PCB Desmear and material treating.

PSM NPT-V31 plasma system has been applied the treatment of PCB& FPCB Desmer and Etch back. More>>

NPT V31:

Vacuum Plasma Cleaner For PCB Desmear & Teflon Activition:

Major Applications:

·         PCB&FPCB Desmear

·         Teflon Surface Activation (Pretreatment for Cu Plating)

·         Cleans Carbon Residues after Laser Machining

·         Clean Wre Mesh for Line Pattern Process.

Specifications:

·         Plasma Source: MF (Medium Frequency) Power

·         Sample Size: 460(W)×610(D)

·         Process Efficiency: 1200-2400 sec/batch

·         PLC Control with Color Touch Screen

·         Sliding Door Type

·         Process Gas: CF4, N2, O2 (with MFC control)

·         Power Source: AC 220V, 50/60 Hz, 3 Phase

·         Electrode: Vertical Type Shelf Plasma Surface Treatment Equipment Korea

System Features:

·         Plasma Efficiency Improvement & Short Process Time by Optimized Design of Electrode

·         Environmental Friendly Process and Safe Working Condition