PSM Material Applications of Reel to Reel Plasma Treatment System
PSM Plasma Systems is global leader plasma technology for
Semiconductor, PCB, LCD and Material industries.
We PSM Inc. has rich experience and excellent staffs who
have developed and commercialized various highly evaluated optimized processing
techniques and practical manufacturing systems which are related to
Semiconductor & Display industry, PCB & FCCL industry and other polymer
industries over 10 years in the Institute for Advanced Engineering.
This is indeed useful technique that is able to improve
productivity and quality simultaneously not only for
semiconductor/displays/electronic parts, but for low-temperature material
industry such as polymer & plastic / FPCB & FCCL by a possible in-line
process. We PSM Inc. are expanding and thriving based on the diverse
world-leading essential patents of atmospheric pressure plasma techniques
throughout the following four areas: semiconductor packaging/display dry
cleaning/polymer materials, surface treatments /environmental system;
furthermore, our technology has acquired a reputation in a wide range of areas.
AP plasma system manufacturer
PSM NPT-307 offers reel-to-reel Plasma system using
atmospheric pressure plasma, and its application for COF, TCP, TCM packaging
process, such as IC chip bumping process, sealing resin process, ACF bonding
process, etc.
The NPT-307 is specially designed for an effective plasma
treatment for a surface modification and cleaning of a reel printed circuit
board (RPCB) in order to improve on wet ability, adhesion, plating, bump
bonding, molding and so forth.
The system has un-winder reel, winder reel, Plasma
electrode, MF (30 kHz) power supply, process gases and PLC interface unit. Flat Panel Display
Manufacturer
Applications:
·
Pre-treatment for IC chip bumping process (TCP,
COF, TCM)
·
Pre-treatment for solder resist printing
·
Pre-treatment for molding process (epoxy seal)
·
Pre-treatment for ACF bonding
Advantages:
·
Highest quality
·
Operator friendly
·
Dry, environmental friendly technique
·
Low operation cost
·
Short treatment times
We use special dielectric materials and electrode design to
obtain more effective breakdown voltage between two opposite electrodes. Gases
between electrodes become ionized into active neutral radicals, ions and
electrons under carefully biased AC voltage. Among these particles, active
neutral radicals are very reactive and, the density of them are very high as
much as 100~1000 times comparing to conventional vacuum plasma particles.

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